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Chip solution selection

When developing the NHX7448 series, Our company evaluated all wifi chips on the market: Qualcomm, Broadcom, mtk, celeno, intel, marvell, quantenna, realtek; multi-dimensional verification, testing, analysis and comparison

  • Chip baseband TX throughput
  • Chip baseband RX throughput
  • Chip baseband TX RF performance
  • Chip baseband RX RF performance
  • Chip baseband TX, RX RF scalability
  • cpu performance
  • cpu io scalability
  • network acceleration processor
  • calorific value
  • range of working temperature
  • Driver code architecture
  • Driver code wifi/network protocol function completion
  • Driver code quality
  • Chip procurement channels
  • Does the chip manufacturer have AE level or above support?
  • Chip cost
  • Chip life cycle
  • Technical barriers to our company
  • Technical barriers to customers

Respond to needs

NHX7448 series

  • wifi protocol: wifi5, wifi6, wifi7
  • WiFi frequency: 2.4Ghz/5.8Ghz/6Ghz
  • WiFi bandwidth: 5Mhz/10Mhz/20Mhz/40Mhz/80Mhz/160Mhz/320Mhz
  • WiFi band: 2g_2x2+5g_2x2; 2g_2x2+5g_4x4; 2g_2x2+5g_2x2+6g_2x2
  • WiFi speed: AC1200M, AX1800M, AX3000M, BE3600M, BE6500M
  • Transmission distance: 500 meters visible in the open air + 10mbps, both AP and STA are NHX-SOM (5db omnidirectional antenna), the distance can reach more than 1000 meters
  • WiFi product positioning: AP/STA/WDS/MESH
  • Netcom product positioning: gateway/sd-wan/router/cpe

Hardware advantages

NHX7448 series

  • Reliability: The entire series adopts Qualcomm chip solution, industrial-grade modules, operating temperature -40° to 85°
  • Test: wifi throughput, Ethernet throughput, radio frequency, high and low temperature, aging, repeated restarts, manufacturability, maintainability, heat dissipation
  • Iteration: Full series size 74mm*48mm, all pin to pin seamless replacement; Meet performance, cost, protocol and other needs with ease.
  • Quality: All components in the entire series are selected from international and domestic first-tier brands.
  • Quality control: Before each board is shipped, multiple functional and performance tests are completed, and test reports are archived. It has been shipped in batches in the industrial routing industry for several years.
  • Packaging: Comprehensive consideration from multiple dimensions such as usage environment, service life, cost, production, maintenance, etc.
  • Planning: wifi7 modules will be shipped in batches in 24Q2
  • Design: At the beginning of the project design, SMD engineers, PCB process engineers, layout engineers, and hardware engineers were linked; in-depth optimization was carried out for stacking, impedance, and packaging.

Software advantages

  • Personnel ratio: only focuses on wifi module research and development, with more than 10 years of experience, and R&D personnel account for 80%;
  • Staff expertise: good at bsp, wifi driver, kernel
  • Roaming compatibility: It can be adapted to any AP on the market. No need to support KVR. Seamless roaming can be achieved in milliseconds (within 50ms) as long as the SSID and password are consistent.
  • Roaming packet loss rate: ping packet loss rate for 200ms each time is 1‰-5‰ (Huawei, H3C AP: 1‰-5‰, other brands: around 5‰)
  • Working mode: router, AC+AP, AP, STA, AP+STA, mesh, among which AP+STA mode can work at the same time (VAP virtualization)
  • Driver: Provides qsdk driver source files, and also provides NHX optimized version driver ko files, targeted optimization: data frames, management frames, retransmission and queue logic; full range supports TDMA protocol stack; self-developed middleware
  • Kernel: Provides qsdk kernel source files, and also provides NHX optimized version kernel binary files, targeted optimization: wifi, network parts
  • Driver development: such as pcie peripheral drivers, USB peripheral drivers; other third-party peripherals
  • Kernel development: Optimize forwarding, multicast, and multicast, such as increasing the multicast rate to the highest mcs level
  • dts: Provides dts source files, commonly used io has been adapted
  • File system: Reconstruct the file system, do not use the official qsdk solution, and specifically optimize and solve nand, emmc: ecc error correction. Meet industrial stability requirements
  • NHX-API: API interface for common functions such as roaming, ac, ap, network, etc.
  • NHX-VUE: vue front-end web module
  • NHX-MESH: mesh
  • NHX-STAROAM: Roaming
  • NHX-IAC: AC controller, automatic discovery of layer 2 broadcasts

Delivery advantage

  • Delivery time: Our company has standing inventory of core components such as main chips and PCBs.
  • Manufacturing capacity: 2 smt lines! SMT, production testing, maintenance: all are dedicated to dedicated personnel and can be controlled independently!
  • Delivery capacity: There are currently 12 testing stations, and 12 testing stations are being prepared at the same time. The daily delivery capacity is 3k, and the monthly delivery capacity is 90k.
  • Personalization: Calmly handle the delivery of configuration versions of various models
  • Quality control: NHX-MES is open to customers to trace every aspect of production and testing

Typical application scenarios

  • Industrial control: AGV/AMR, medical AGV, PLC collaborative control, gantry crane remote control, port automation, smart mines
  • Intelligent monitoring: park monitoring, outdoor monitoring, distribution room monitoring
  • Energy and power: power differential protection, distribution automation, substation inspection robot
  • Low-speed Internet of Vehicles: autonomous driving, unmanned vehicles in parks, and Internet of Vehicles for cleaning

cost analysis

  • Material cost: The cost of core module + base board is higher than the cost of single board; additional PCB cost, secondary production cost, everything else is the same
  • Testing cost: The cost of core module + backplane is lower than the cost of a single board; the core module is automatically tested, the single board interface is inconsistent, and the test operation process is not unified
  • Time cost: The core module only needs to be developed and tested once, and other projects will continue to use it, and the batch can be batched as soon as three months.
  • R&D cost: core module + base board, only the base board needs to be developed, no need to repeat R&D to verify key performance
  • After-sales costs: The core module is more mature, multiple projects, multiple customers in batches; accumulated bug fixes
  • Certification cost: Core module certification can use multiple projects. Single boards vary greatly and each product needs to be certified (FCC/IC/CE/TELEC/SRRC costs about 30w RMB per product)

Product Disadvantages

  • From a purely BOM cost perspective, the cost of core modules + baseboard is greater than the cost of a single board.